JPS6127178Y2 - - Google Patents

Info

Publication number
JPS6127178Y2
JPS6127178Y2 JP1980135970U JP13597080U JPS6127178Y2 JP S6127178 Y2 JPS6127178 Y2 JP S6127178Y2 JP 1980135970 U JP1980135970 U JP 1980135970U JP 13597080 U JP13597080 U JP 13597080U JP S6127178 Y2 JPS6127178 Y2 JP S6127178Y2
Authority
JP
Japan
Prior art keywords
integrated circuit
linear conductor
conductor pattern
pattern
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1980135970U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5759448U (en]
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1980135970U priority Critical patent/JPS6127178Y2/ja
Publication of JPS5759448U publication Critical patent/JPS5759448U/ja
Application granted granted Critical
Publication of JPS6127178Y2 publication Critical patent/JPS6127178Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

Landscapes

  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP1980135970U 1980-09-26 1980-09-26 Expired JPS6127178Y2 (en])

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1980135970U JPS6127178Y2 (en]) 1980-09-26 1980-09-26

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1980135970U JPS6127178Y2 (en]) 1980-09-26 1980-09-26

Publications (2)

Publication Number Publication Date
JPS5759448U JPS5759448U (en]) 1982-04-08
JPS6127178Y2 true JPS6127178Y2 (en]) 1986-08-13

Family

ID=29496112

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1980135970U Expired JPS6127178Y2 (en]) 1980-09-26 1980-09-26

Country Status (1)

Country Link
JP (1) JPS6127178Y2 (en])

Also Published As

Publication number Publication date
JPS5759448U (en]) 1982-04-08

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